LASER CUTTING OF THIN MATERIALS

LAI offers tight-tolerance, high-speed cutting and slitting of thin materials, including film, foils, industrial cloth, non-wovens and wovens, and rolled material. High-speed CO2 laser cutting services handle ceramins, Kapton polyimide film, plastics, polymers, thermal-bond adhesives and other thin materials. 

LAI's laser workstations cut thin adhesive materials using a non-contact method, allowing complex geometries to be cut with accuracy and stability. We produce our own vacuum fixtures for precision set-up and controls. LAI's cutting methods minimizes material waste with near full yield. LAI also provides -80 degree Celcius storage for extended shelf lives of special materials. Highly accurate video inspections are also utilized to certify conformity to customer drawings or electronic models. LAI also offers camera alignment of materials for orientation to a pre-existing features, if necessary. 

Laser Cutting of Thin Materials

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LAI incorporates special laser-beam splitting techniques for cutting and converting advanced rolled materials.

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An LAI technician inspects laser-cut printed
circuit boards.


Thin material processing services include:

  • Cutting of slots, holes, patterns and small features with tight tolerances.
  • Vision system coordinate inspection.
  • Ultra-cold-temperature storage to -70 F (-57C).
  • Multi-head processing and in-house tooling available.